A METHOD FOR FINE BONDING WIRE DETECTION USING LIGHT DIFFRACTION

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International Journal on Smart Sensing and Intelligent Systems

Professor Subhas Chandra Mukhopadhyay

Exeley Inc. (New York)

Subject: Computational Science & Engineering, Engineering, Electrical & Electronic

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VOLUME 4 , ISSUE 1 (March 2011) > List of articles

A METHOD FOR FINE BONDING WIRE DETECTION USING LIGHT DIFFRACTION

Yong Xiao * / Xiaoyan Wang / Kuanyi Zhu / Xiaoyu Ge / Jingna Sun

Keywords : Bonding wire, diffraction, slot, and irradiance.

Citation Information : International Journal on Smart Sensing and Intelligent Systems. Volume 4, Issue 1, Pages 12-124, DOI: https://doi.org/10.21307/ijssis-2017-429

License : (CC BY-NC-ND 4.0)

Published Online: 12-December-2017

ARTICLE

ABSTRACT

In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, and a slot introduced in the path of light source generates diffraction pattern. Then, irradiance loss of the corresponding diffraction pattern at the receiver could be observed, due to the presence of a wire. Simulation and experimental results show that the proposed method with a slot design renders satisfactory performance of wire detection.

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REFERENCES

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