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Citation Information : International Journal on Smart Sensing and Intelligent Systems. Volume 4, Issue 1, Pages 12-124, DOI: https://doi.org/10.21307/ijssis-2017-429
License : (CC BY-NC-ND 4.0)
Published Online: 12-December-2017
In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip . With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, and a slot introduced in the path of light source generates diffraction pattern. Then, irradiance loss of the corresponding diffraction pattern at the receiver could be observed, due to the presence of a wire. Simulation and experimental results show that the proposed method with a slot design renders satisfactory performance of wire detection.
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