Article | 05-September-2013
Qianping Wang,
Ruoyu Li,
Liangli LAI,
Lei Kong
International Journal on Smart Sensing and Intelligent Systems, Volume 6 , ISSUE 4, 1653–1674
Article | 10-April-2018
Wearable equipment in recent years has been rapid development. But the hardware manufacturing complexity and the high cost is a real problem. This paper introduces a microprocessor cluster with both hardware design principle and related distributed software design methods. This cluster has the characteristics of low cost, high reliability, flexible hardware and software system structure, low power consumption, simple equipment manufacturing process and so on, especially suitable for wearable
Xin Liu,
Zhiqiang Wei
International Journal of Advanced Network, Monitoring and Controls, Volume 2 , ISSUE 3, 27–32
Article | 14-July-2019
Electronic systems are very important part of the automotive industry. Electronic products have high reliability due to the critical functions performed by some of the modern modules. Cyclic mechanical load and vibration are main of the conditions, that the electronic modules are subjected during the transport. In this paper, the main incompatibilities in the internal transport processes of soldering of selected elements for automotive company are presented. The main purpose of the article is
Bożena SZCZUCKA-LASOTA,
Tomasz WĘGRZYN,
Krzysztof GARBALA,
Jan PIWNIK,
Wojciech MAJEWSKI
Transport Problems, Volume 14 , ISSUE 2, 19–28